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Correction carrier - List of Manufacturers, Suppliers, Companies and Products

Correction carrier Product List

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[Success Case] DP Attached Correction Carrier - The Most Appreciated Points -

Customers who have adopted the DP payment correction carrier are most pleased with the customization tailored to their environment. Here are some examples of customization.

The most common feedback from customers who have adopted DP correction carriers and pad dressers is the customization tailored to their processing environment. Typically, customers often purchase fixed pattern products or use those that come with their equipment, but is it suitable for their equipment? On the other hand, our products build unique patterns that incorporate both the basic pattern and the customer's requests. Changes made so far include: - Material changes (selecting materials considering corrosion and strength) - Pattern changes (constructing the best pattern based on precision, rate, and free test results) - Granularity changes (selecting the appropriate grit based on pre-tests for the current PAD) We create products with considerable effort that other companies may not want to undertake. * Adjustments to the thickness of various materials (carrier, DP) and the construction of immediately usable DP surface conditions, etc. Please download the materials to check the features of the DP correction carrier. For inquiries about testing and customization, please contact us.

  • Wafer processing/polishing equipment

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What are the dangers lurking in the corrective career (padded dresser)?

When it comes to modifying grinding pads, the DP-equipped correction carrier is used as a matter of course, but it actually has significant disadvantages as well. Do you know what they are?

The basics of polishing emphasize the importance of precision management of the polishing pad, and a commonly used tool for maintaining that precision is the DP-equipped correction carrier. Using a correction carrier not only allows for precision adjustments but also plays a crucial role in cleaning the pad. However, depending on the situation, there are significant and dangerous disadvantages when it comes to polishing. 1. Rust 2. Slow polishing speed on the upper side 3. Requires two people for setup (or needs to be set up with a machine) Among these three, the common factor related to "different polishing speeds on the upper and lower sides" and "setup issues" is "weight." When considering setup, it’s easy to imagine that a lighter weight can lead to improved workability and safety, even with larger equipment. On the other hand, what is the relationship between the polishing speeds of the upper and lower sides and weight? Polishing conditions are set in grams. Therefore, the weight of the correction carrier can negatively impact dressing and truing. The heavier the carrier, the greater the pressure applied to the lower side, leading to changes in the surface condition of the upper and lower pads. It is undoubtedly better for the correction carrier to be lighter in order to maintain as similar a condition as possible. Would you like to try an ultra-lightweight correction carrier for free to counteract such disadvantages?

  • Wafer processing/polishing equipment

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The finishing accuracy of polishing is determined by the condition of the polishing pad.

The basics of polishing involve the maintenance and management of the precision of the polishing pads. It is dangerous if symptoms such as the following are observed.

Isn't this something you've experienced? - The polishing time has increased. - Decreased yield (the workpiece edge becomes rounded). - There are times when flatness is compromised. While the condition of the polishing material and the polishing processing conditions also have an impact, let's first check if the accuracy of the PAD has deteriorated. The basic idea of polishing is that the accuracy of the polishing PAD is transferred to the workpiece. In many cases, a DP correction carrier is used for PAD correction. However, it is often used without much thought, and the most important point, "correction," is frequently not done properly. To determine if the correction carrier is suitable, please check the following: - Is the PAD designed to be correctable? - Is a DP that can dress the PAD being used? - Is the overall thickness of the correction carrier uniform? If you experience any of the following after using the correction carrier in polishing: - The polishing rate does not recover. - The yield does not improve (does not return). - Changes in the PAD surface condition are not noticeable. Please feel free to consult with us. If you have been using it for a long time without maintenance, the correction capability may have been lost.

  • Wafer processing/polishing equipment

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